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d u a l e n h a n c e m e n t m o d e m o s f e t ( n - a n d p - c h a n n e l ) c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 0 8 w w w . a n p e c . c o m . t w 1 a n p e c r e s e r v e s t h e r i g h t t o m a k e c h a n g e s t o i m p r o v e r e l i a b i l i t y o r m a n u f a c t u r a b i l i t y w i t h o u t n o t i c e , a n d a d v i s e c u s t o m e r s t o o b t a i n t h e l a t e s t v e r s i o n o f r e l e v a n t i n f o r m a t i o n t o v e r i f y b e f o r e p l a c i n g o r d e r s . a p m 4 5 4 8 a k apm4548a handling code temp. range package code package code k : sop-8 operating junction temp. range c : -55 to 150 c handling code tr : tape & reel assembly material l : lead free device g : halogen and lead free device apm4548a k : apm4548a xxxxx xxxxx - date code assembly material f e a t u r e s p i n d e s c r i p t i o n o r d e r i n g a n d m a r k i n g i n f o r m a t i o n t o p v i e w o f s o p - 8 n - c h a n n e l m o s f e t p - c h a n n e l m o s f e t g1 s1 d1 d1 (8) (7) (2) (1) g2 s2 d2 d2 (6) (5) (4) (3) n - c h a n n e l 3 0 v / 7 a , r d s ( o n ) = 1 8 m w ( t y p . ) @ v g s = 1 0 v r d s ( o n ) = 2 3 m w ( t y p . ) @ v g s = 4 . 5 v p - c h a n n e l - 3 0 v / - 6 a , r d s ( o n ) = 3 2 m w ( t y p . ) @ v g s = - 1 0 v r d s ( o n ) = 4 2 m w ( t y p . ) @ v g s = - 4 . 5 v s u p e r h i g h d e n s e c e l l d e s i g n r e l i a b l e a n d r u g g e d l e a d f r e e a n d g r e e n d e v i c e s a v a i l a b l e ( r o h s c o m p l i a n t ) a p p l i c a t i o n s p o w e r m a n a g e m e n t i n n o t e b o o k c o m p u t e r , p o r t a b l e e q u i p m e n t , a n d b a t t e r y p o w e r e d s y s t e m s note: anpec lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina- tion finish; which are fully compliant with rohs. anpec lead-free products meet or exceed the lead-free requirements of ipc/jedec j-std-020c for msl classification at lead-free peak reflow temperature. anpec defines ?green? to mean lead-free (rohs compliant) and halogen free (br or cl does not exceed 900ppm by weight in homogeneous material and total of br and cl does not exceed 1500ppm by weight).
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 0 8 w w w . a n p e c . c o m . t w 2 a p m 4 5 4 8 a k a b s o l u t e m a x i m u m r a t i n g s ( t a = 2 5 c u n l e s s o t h e r w i s e n o t e d ) e l e c t r i c a l c h a r a c t e r i s t i c s ( t a = 2 5 c u n l e s s o t h e r w i s e n o t e d ) symbol parameter n channel p channel unit v dss drain - source voltage 30 - 30 v gss gate - source voltage 20 20 v i d * c ontinuous drain current 7 - 6 i dm * pulsed drain current v gs =10v (n) v gs = - 10v (p) 30 - 20 a i s * diode continuous forward current 2.5 - 2. 5 a t j maximum junction temperature 150 t stg storage temperature range - 55 to 150 c t a =25 c 2 p d * power dissipation t a =100 c 0.8 w r q ja * thermal resistance - junction to ambient 62.5 c / w note : *surface mounted on 1in 2 pad area, t 10sec. apm 4548 a k symbol parameter test condition min. typ. max. unit static characteristics v gs =0v, i ds =250 m a n - ch 30 bv dss drain - source breakdown voltage v gs =0v, i ds = - 250 m a p - ch - 30 v v ds = 24 v, v gs =0v 1 t j =85 c n - ch 30 v ds = - 24 v, v gs =0v - 1 i dss zero gate voltage drain current t j =85 c p - ch - 30 m a v ds =v gs , i ds =250 m a n - ch 1 1. 8 2 .5 v gs(th) gate threshold voltage v ds =v gs , i ds = - 250 m a p - ch - 1 - 1. 8 - 2 .5 v n - ch 10 i gss gate leakage current v gs =16v, v ds =0v p - ch 10 m a v gs =10v, i ds = 7 a n - ch 18 24 v gs = - 10v, i ds = - 6 a p - ch 32 42 v gs =4.5v, i ds = 5 a n - ch 23 30 r ds(on) a drain - source on - s tate resistance v gs = - 4. 5v, i ds = - 5 a p - ch 42 55 m w
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 0 8 w w w . a n p e c . c o m . t w 3 a p m 4 5 4 8 a k e l e c t r i c a l c h a r a c t e r i s t i c s ( c o n t . ) ( t a = 2 5 c u n l e s s o t h e r w i s e n o t e d ) apm 4548 a k symbol parameter test condition min. typ. max. unit diode characteristics i sd = 2 .5a, v gs =0v n - ch 0.8 1. 1 v sd a diode forward voltage i sd = - 2 .5a, v gs =0v p - ch - 0.8 - 1. 1 v n - ch 14 t rr reverse recovery time p - ch 15 n s n - ch 7 q rr reverse recovery charge n - channel i sd = 7 a, di sd /dt =10 0a/ m s p - chan nel i sd = - 6 a, di sd /dt =10 0a/ m s p - ch 7 n c dynamic characteristics b n - ch 3.6 r g gate r esistance v gs = 0 v,v ds =0v ,f=1mhz p - ch 8 w n - ch 990 c iss input capacitance p - ch 1150 n - ch 150 c oss output capacitance p - ch 150 n - ch 115 c rss reverse transfer capacitance n - channel v gs =0v, v ds =15 v, f requency =1.0mhz p - channel v gs =0v, v ds = - 15v, f requency =1.0mhz p - ch 105 pf n - ch 9 17 t d(on) turn - on delay time p - ch 8 15 n - ch 10 19 t r turn - on rise time p - ch 11 21 n - ch 33 60 t d(off) turn - off delay time p - ch 49 89 n - ch 11 21 t f turn - off fall tim e n - channel v dd = 1 5 v, r l = 15 w , i d s = 1 a, v gen = 10v , r g = 6 w p - channel v dd = - 15 v, r l = 15 w , i d s = - 1 a, v gen = - 10v , r g = 6 w p - ch 21 39 ns gate charge characteristics b n - ch 20 28 q g total gate charge p - ch 20 28 n - ch 2.4 q gs gate - source charge p - ch 2.9 n - ch 4.5 q gd gate - d rain charge n - channel v ds = 15 v, v gs = 10 v, i d s = 7 a p - channel v ds = - 15 v, v gs = - 10 v, i d s = - 6 a p - ch 4 nc n o t e s : a : p u l s e t e s t ; p u l s e w i d t h 3 0 0 m s , d u t y c y c l e 2 % . b : g u a r a n t e e d b y d e s i g n , n o t s u b j e c t t o p r o d u c t i o n t e s t i n g .
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 0 8 w w w . a n p e c . c o m . t w 4 a p m 4 5 4 8 a k t y p i c a l c h a r a c t e r i s t i c s i d - drain current (a) d r a i n c u r r e n t t j - j u n c t i o n t e m p e r a t u r e ( c ) s a f e o p e r a t i o n a r e a v d s - d r a i n - s o u r c e v o l t a g e ( v ) t h e r m a l t r a n s i e n t i m p e d a n c e s q u a r e w a v e p u l s e d u r a t i o n ( s e c ) p o w e r d i s s i p a t i o n p tot - power (w) t j - j u n c t i o n t e m p e r a t u r e ( c ) i d - drain current (a) n - c h a n n e l normalized transient thermal resistance 0 20 40 60 80 100 120 140 160 0.0 0.5 1.0 1.5 2.0 2.5 t a =25 o c 0 20 40 60 80 100 120 140 160 0 1 2 3 4 5 6 7 8 t a =25 o c,v g =10v 1e-4 1e-3 0.01 0.1 1 10 30 1e-3 0.01 0.1 1 2 mounted on 1in 2 pad r q ja : 62.5 o c/w 0.01 0.02 0.05 0.1 0.2 single pulse duty = 0.5 0.01 0.1 1 10 100 0.01 0.1 1 10 100 300 m s rds(on) limit 1s t a =25 o c 10ms 1ms 100ms dc
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 0 8 w w w . a n p e c . c o m . t w 5 a p m 4 5 4 8 a k r ds(on) - on - resistance (m w ) d r a i n - s o u r c e o n r e s i s t a n c e i d - d r a i n c u r r e n t ( a ) t j - j u n c t i o n t e m p e r a t u r e ( c ) g a t e t h r e s h o l d v o l t a g e v d s - d r a i n - s o u r c e v o l t a g e ( v ) i d - drain current (a) o u t p u t c h a r a c t e r i s t i c s d r a i n - s o u r c e o n r e s i s t a n c e v g s - g a t e - s o u r c e v o l t a g e ( v ) r ds(on) - on - resistance (m w ) normalized threshold voltage t y p i c a l c h a r a c t e r i s t i c s ( c o n t . ) n - c h a n n e l 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 5 10 15 20 25 30 3.5v 2.5v 3v v gs = 4, 5, 6, 7, 8, 9, 10v 0 5 10 15 20 25 30 15 20 25 30 35 40 45 50 v gs =10v v gs =4.5v 1 2 3 4 5 6 7 8 9 10 20 25 30 35 40 45 50 55 60 65 70 i d =7a -50 -25 0 25 50 75 100 125 150 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 i ds =250 m a
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 0 8 w w w . a n p e c . c o m . t w 6 a p m 4 5 4 8 a k v d s - d r a i n - s o u r c e v o l t a g e ( v ) d r a i n - s o u r c e o n r e s i s t a n c e normalized on resistance t j - j u n c t i o n t e m p e r a t u r e ( c ) c - capacitance (pf) v s d - s o u r c e - d r a i n v o l t a g e ( v ) s o u r c e - d r a i n d i o d e f o r w a r d i s - source current (a) c a p a c i t a n c e g a t e c h a r g e q g - g a t e c h a r g e ( n c ) v gs - gate - source voltage (v) t y p i c a l c h a r a c t e r i s t i c s ( c o n t . ) n - c h a n n e l -50 -25 0 25 50 75 100 125 150 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 r on @t j =25 o c: 18m w v gs = 10v i ds = 7a 0.0 0.4 0.8 1.2 1.6 2.0 0.1 1 10 30 t j =150 o c t j =25 o c 0 5 10 15 20 25 30 0 200 400 600 800 1000 1200 1400 frequency=1mhz crss coss ciss 0 4 8 12 16 20 24 0 1 2 3 4 5 6 7 8 9 10 v ds = 15v i d = 7a
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 0 8 w w w . a n p e c . c o m . t w 7 a p m 4 5 4 8 a k t y p i c a l c h a r a c t e r i s t i c s ( c o n t . ) p o w e r d i s s i p a t i o n p tot - power (w) t j - j u n c t i o n t e m p e r a t u r e ( c ) -i d - drain current (a) d r a i n c u r r e n t t j - j u n c t i o n t e m p e r a t u r e ( c ) s a f e o p e r a t i o n a r e a - v d s - d r a i n - s o u r c e v o l t a g e ( v ) t h e r m a l t r a n s i e n t i m p e d a n c e s q u a r e w a v e p u l s e d u r a t i o n ( s e c ) -i d - drain current (a) p - c h a n n e l normalized transient thermal resistance 0 20 40 60 80 100 120 140 160 0.0 0.5 1.0 1.5 2.0 2.5 t a =25 o c 0 20 40 60 80 100 120 140 160 0 1 2 3 4 5 6 7 t a =25 o c,v g =-10v 1e-4 1e-3 0.01 0.1 1 10 30 1e-3 0.01 0.1 1 2 mounted on 1in 2 pad r q ja : 62.5 o c/w 0.01 0.02 0.05 0.1 0.2 single pulse duty = 0.5 0.01 0.1 1 10 100 0.01 0.1 1 10 100 300us rds(on) limit 1s t a =25 o c 10ms 1ms 100ms dc
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 0 8 w w w . a n p e c . c o m . t w 8 a p m 4 5 4 8 a k t y p i c a l c h a r a c t e r i s t i c s ( c o n t . ) r ds(on) - on - resistance (m w ) d r a i n - s o u r c e o n r e s i s t a n c e - i d - d r a i n c u r r e n t ( a ) - v d s - d r a i n - s o u r c e v o l t a g e ( v ) -i d - drain current (a) o u t p u t c h a r a c t e r i s t i c s t j - j u n c t i o n t e m p e r a t u r e ( c ) g a t e t h r e s h o l d v o l t a g e d r a i n - s o u r c e o n r e s i s t a n c e - v g s - g a t e - s o u r c e v o l t a g e ( v ) r ds(on) - on - resistance (m w ) normalized threshold voltage p - c h a n n e l 1 2 3 4 5 6 7 8 9 10 20 30 40 50 60 70 80 90 i d = -6a -50 -25 0 25 50 75 100 125 150 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 i ds = -250 m a 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 2 4 6 8 10 12 14 16 18 20 -2.5v -3.5v -3v v gs = -4,-5,-6,-7,-8,-9,-10v 0 4 8 12 16 20 20 25 30 35 40 45 50 55 60 65 v gs = -10v v gs = -4.5v
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 0 8 w w w . a n p e c . c o m . t w 9 a p m 4 5 4 8 a k t y p i c a l c h a r a c t e r i s t i c s ( c o n t . ) d r a i n - s o u r c e o n r e s i s t a n c e normalized on resistance t j - j u n c t i o n t e m p e r a t u r e ( c ) - v s d - s o u r c e - d r a i n v o l t a g e ( v ) s o u r c e - d r a i n d i o d e f o r w a r d -i s - source current (a) - v d s - d r a i n - s o u r c e v o l t a g e ( v ) c - capacitance (pf) c a p a c i t a n c e g a t e c h a r g e q g - g a t e c h a r g e ( n c ) -v gs - gate - source voltage (v) p - c h a n n e l -50 -25 0 25 50 75 100 125 150 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 r on @t j =25 o c: 32m w v gs = -10v i ds = -6a 0 5 10 15 20 25 30 0 200 400 600 800 1000 1200 1400 1600 frequency=1mhz crss coss ciss 0 4 8 12 16 20 24 0 1 2 3 4 5 6 7 8 9 10 v ds = -15v i d = -6a 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.1 1 10 20 t j =150 o c t j =25 o c
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 0 8 w w w . a n p e c . c o m . t w 1 0 a p m 4 5 4 8 a k p a c k a g e i n f o r m a t i o n s o p - 8 s y m b o l min. max. 1.75 0.10 0.17 0.25 0.25 a a1 c d e e1 e h l millimeters b 0.31 0.51 sop-8 0.25 0.50 0.40 1.27 min. max. inches 0.069 0.004 0.012 0.020 0.007 0.010 0.010 0.020 0.016 0.050 0 0.010 1.27 bsc 0.050 bsc a2 1.25 0.049 0 8 0 8 d e e e 1 see view a c b h x 4 5 a a 1 a 2 l view a 0 . 2 5 seating plane gauge plane note: 1. follow jedec ms-012 aa. 2. dimension ? d ? does not include mold flash, protrusions or gate burrs. mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. dimension ? e ? does not include inter-lead flash or protrusions. inter-lead flash and protrusions shall not exceed 10 mil per side. 3.80 5.80 4.80 4.00 6.20 5.00 0.189 0.197 0.228 0.244 0.150 0.157
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 0 8 w w w . a n p e c . c o m . t w 1 1 a p m 4 5 4 8 a k application a h t1 c d d w e1 f 330.0 ? 2.00 50 min. 12.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 12.0 ? 0.30 1.75 ? 0.10 5.5 ? 0.05 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 sop - 8 4.0 ? 0.10 8.0 ? 0.10 2.0 ? 0.05 1.5+0.10 - 0.00 1.5 min. 0.6+0.00 - 0.40 6.40 ? 0.20 5.20 ? 0.20 2.10 ? 0.20 (mm) c a r r i e r t a p e & r e e l d i m e n s i o n s h t1 a d a e 1 a b w f t p0 od0 b a0 p2 k0 b 0 section b-b section a-a od1 p1 d e v i c e s p e r u n i t package type unit quantity sop - 8 tape & reel 2500
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 0 8 w w w . a n p e c . c o m . t w 1 2 a p m 4 5 4 8 a k r e f l o w c o n d i t i o n ( i r / c o n v e c t i o n o r v p r r e f l o w ) t 25 c to peak tp ramp-up t l ramp-down ts preheat tsmax tsmin t l t p 25 t e m p e r a t u r e time critical zone t l to t p test item method description solderability mil - std - 883d - 2003 245 c, 5 sec holt mil - std - 883d - 1005.7 1000 hrs bias @125 c pct jesd - 22 - b,a102 168 hrs, 100 % rh, 121 c tst mil - std - 883d - 1011.9 - 65 c~150 c, 200 cycles r e l i a b i l i t y t e s t p r o g r a m
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 0 8 w w w . a n p e c . c o m . t w 1 3 a p m 4 5 4 8 a k profile feature sn - pb eutectic assembly pb - free assembly average ramp - up rate (t l to t p ) 3 c/second max. 3 c/second max. preheat - temperature min (tsmin) - temperature max (tsmax) - time (min to max) (ts) 100 c 150 c 60 - 120 seconds 150 c 200 c 60 - 180 seconds time maintained above: - temperature (t l ) - time (t l ) 183 c 60 - 150 seconds 217 c 60 - 150 seconds peak /classification temperature (tp) see table 1 see table 2 time within 5 c of actual peak temperature (tp) 10 - 30 seconds 20 - 40 seconds ramp - down rate 6 c/sec ond max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. notes: all temperatures refer to topside of the package. measured on the body surface. c u s t o m e r s e r v i c e table 1. snpb entectic process ? package peak reflow temperature s package thickness volume mm 3 <350 volume mm 3 3 350 <2.5 mm 240 +0/ - 5 c 225 +0/ - 5 c 3 2.5 mm 225 +0/ - 5 c 225 +0/ - 5 c table 2. pb - free process ? package classification reflow temperatures package thickness volume mm 3 <350 volume mm 3 350 - 2000 volume mm 3 >2000 <1.6 mm 260 +0 c* 260 +0 c* 260 +0 c* 1.6 mm ? 2.5 mm 260 +0 c* 250 +0 c* 245 +0 c* 3 2.5 mm 250 +0 c* 245 +0 c* 245 +0 c* * tolerance: the device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means peak reflow temperature +0 c. for example 260 c+0 c) at the rated msl level. c l a s s i f i c a t i o n r e f l o w p r o f i l e s a n p e c e l e c t r o n i c s c o r p . head office : no.6, dusing 1st road, sbip, hsin-chu, taiwan tel : 886-3-5642000 fax : 886-3-5642050 t a i p e i b r a n c h : 2 f , n o . 1 1 , l a n e 2 1 8 , s e c 2 j h o n g s i n g r d . , s i n d i a n c i t y , t a i p e i c o u n t y 2 3 1 4 6 , t a i w a n t e l : 8 8 6 - 2 - 2 9 1 0 - 3 8 3 8 f a x : 8 8 6 - 2 - 2 9 1 7 - 3 8 3 8

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